W.F. Taylor Co. Inc., Fontana, CA, announces the introduction of its latest development in Next Generation technology, Meta-tec® MS-Plus Wood Flooring Adhesive. The product combines Taylor’s patented Meta-tec® technology with Telechelic Modified Silane Polymer chemistry.
This 100% solids, moisture cure adhesive represents a significant advancement in moisture cure adhesive technology. The product offers improved early green strength, excellent moisture resistance and a strong, elastic bond for the installation of all types of engineered and solid wood flooring. The product is also Greenguard® tested and approved.
According to Jack Raidy Jr., President and CEO, Taylor wanted to offer the marketplace advancement in both performance and environmental soundness. “We wanted to match or exceed performance characteristics that are already so successful for our Meta-tec® #2071, but add a product entry to the 100% solids moisture cure class of adhesives. We felt the marketplace could use a one-two product punch depending on the installation preferences of installers. We also wanted a product that could pass the Greenguard® certification so we basically had to remove all the solvents and isocyanate bi-products commonly found in most moisture cure urethane adhesives.”
The product was launched first in the United Kingdom back in February at the London Floor Show and has shown steady growth in popularity there. Taylor has launched the Meta-tec® MS-Plus adhesive in the U.S. at the NWFA April Convention last week. Taylor also plans to continue offering its #2071 Tuff-Lok X-Link Wood Flooring Adhesive along with MS-Plus.
Media Contact:
Mihir Gandhi
W. F. Taylor Co., Inc.
(951) 360-6677 ext: 100
mgandhi@wftaylor.com
